The KoldLok® Integral raised floor grommet is designed for new installations and fits into the raised floor tiles prior to the installation of the cabinets. Based on measurements at multiple data centres, between 50% – 80% of conditioned air is not reaching the air intake of IT equipment due to unsealed flooring openings.
This lost air, known as bypass airflow, contributes to IT equipment hot spots, cooling unit inefficiencies and increasing infrastructure costs. By sealing cable cut-outs with KoldLok® raised floor grommets you can address this bypass airflow, so drastically improving the cooling capacity within the data centre and preventing the detrimental effects bypass airflow has.
Designed to seal openings in new raised floor cutouts prior to the installation of communications or power cabling. Based on measurements at multiple data centres,on average 60% of valuable conditioned air is not reaching the air intake of IT equipment due to unsealed floor openings.
This lost air, known as bypass airflow,contributes to IT equipment hot spots,cooling unit inefficiencies, and increasing infrastructure costs. KoldLok® products specifically address bypass airflow and its detrimental effects on data centre cooling.
Overall size (W x D x H)
279 x 210 x 41
11 x 8¼ x 1⅝
Product height above the raised floor
Usable cable area
203 x 102
8 x 4
Cut required to install Grommet in interior of the tile
235 x 172
9¼ x 6¾
Cut required to install long side of the Grommet on the tile edge
235 x 191
9¼ x 7½
Cut required to install short side of the Grommet on the tile edge
172 x 260
6¾ x 10¼
(U.S. Patent No. RE41863 and International Patents Pending) Multi-layer, opposing and interwoven filaments consisting of:
Four (4) self-drilling screws are provided for installation.
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